Centerline Technologies capabilities include precision lapping, polishing, laser machining, diamond sawing, edge/diamond machining, tumbling and a filled via planarity process. Materials, Alumina (99.6% & 96%), AlN, BeO, Fused Silica / Quartz, Sapphire, Lithium Niobate, Titanates, Ferrites, Garnet, Silicon Carbide, Tungsten Carbide and more.

Centerline Technologies was founded in 2005 by Hugh Muffoletto to meet the growing demand for high-quality, ultra-precision surface finishing in the telecommunication, semiconductor, communication, micro-electronic, defense and security markets. Services include grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials.