Centerline Technologies
Centerline Technologies capabilities include precision lapping, polishing, laser machining, diamond sawing, edge/diamond machining, tumbling and a filled via planarity process. Materials, Alumina (99.6% & 96%), AlN, BeO, Fused Silica / Quartz, Sapphire, Lithium Niobate, Titanates, Ferrites, Garnet, Silicon Carbide, Tungsten Carbide and more.
Centerline Technologies was founded in 2005 by Hugh Muffoletto to meet the growing demand for high-quality, ultra-precision surface finishing in the telecommunication, semiconductor, communication, micro-electronic, defense and security markets. Services include grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials.
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Company Details:
Street, No.: |
577 Main Street |
Tel: |
978-568-1330 |
State: |
Massachusetts |
Fax: |
978-568-1334 |
Zip: |
01749 |
Cell: |
978-549-7045 |
City: |
Hudson |
Employees: |
11 |
Country: |
United States |
Founded: |
2005 |
Attn: |
Hugh Muffoletto |
Email: |
Send Email |
Website: |
http://www.centerlinetech-usa.com |
Certificates: |
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